Dryer for final curing

The IR-drying line is designed to final cure LPI Solder mask on pcb´s. The heating system ensures a fast and homogenous curing of the paste. The printed circuit boards run through the process zone on a teflon-coated glass fibre textile belt. Following the heating zone, the printed circuit boards are transported to a cooling zone for being cooled down again to less than 40°C, depends on panel thickness.

Heating system:

The heating system is made up of several stainless steel process muffles.

The number of process muffles is subject to the respective capacity required.
The stainless steel process muffle is made up of a double wall and insulated in the interior.  This design ensures both very good insulation value and low energy consumption.
A further asset is that this plant design is clean-room-proof.
The process muffle allows to be opened segment by segment by spring covers, which ensure the access to both the product and the incorporated components.

The heating zone is made up of 10 (5 on top and 5 below) separately adjustable IR-heating zones, medium-waved ceramic IR- radiators of the company Elstein are used as heating source. The different radiators are combined as heating group and regulated by a temperature probe. The heating zones are arranged five on top and five on bottom of the transport system.
This combination of the IR heater’s top and bottom side produces a very exact temperature distribution and a very efficient drying process.
The exhausted air in each zone can be adjusted by throttle valves so that the escaping solvents can be sucked off in an efficient manner.

Technical data:

Pictures:

   

Get infos on our products: 
Coating- LG 250, VCR100
Drying- (horizontally) HET 120, IR/16 KW, ABL 30, (vertically) VDH 248, MD4000
Handling- Horizontal Loader HS, Vertical Loader VS, Transport Modules XT/US1/XTP, TVA Separators, TA Automatic Separators, SV100 Plane Raze Device